MediaTek presents the Dimensity 9200 chip: efficiency and GPU at the top

After glimpsing it with stratospheric results on AnTuTu e GFXBench, MediaTek he lifted the veil on his new SoC top of the range, the Dimensity 9200.

Il chip, representing a series of “first times“for the sector of SoC for smartphones for being equipped with the new ones core Cortex-X3 e Cortex-A715 of ARM, as well as based on the process at 4nm of the second generation TSMC, points high and represents a substantial improvement compared to the recent Dimensity 9000 Plus. Let’s see why.

Amazon offer

From a design point of view, the new chips in MediaTek it is based on architecture Armv9, which promises better safety and performance. From the point of view of CPUwe have an octa-core configuration, consisting of

  • 1 core ARM Cortex-X3 a 3,05 GHz
  • 3 core ARM Cortex-A715 a 2,85 GHz
  • 4 efficiency core ARM Cortex-A510

Lato GPU, we have the brand new GPU Immortal G715 di ARMwith 11 cores, support Vulkan 1.3 and full hardware support to the Ray Tracinga decisive step forward compared to the Small G710 last year and theoretically capable of reaching 240 Hz in Full HD.

  • 1x Arm Cortex-X3 @ 3.05GHz
  • 3x Arm Cortex-A715 @ 2.85GHz
  • 4x Arm Cortex-A510 @ 1.8GHz
  • Immortal Arm G715 GPU
  • Raytracing
  • Maximum On-Device Display support: FHD+ @ 240Hz
  • WHQD up to 144Hz
  • 5K (2.5kx2) up to 60Hz
  • 6th Gen APU (APU690)
  • 35% faster performance in ETHZ5.0 benchmark over 5th gen
  • 18-bit HDR ISP
  • 4K HDR video on 3 cameras simultaneously
  • Native RGBW sensor support
  • Up to 12.5% power savings recording 8K with EIS
  • Sub-6GHz + mmWave ready
  • Throughput: 7.9Gbps
  • 4CC Carrier Aggregation
  • 8CC mmWave
  • MediaTek 5G UltraSve 3.0
  • Bluetooth 5.3
  • Wi-Fi 7 up to 65 Gbps
  • Wireless Stereo Audio
  • TSMC’s N4P 2nd Gen 4nm process

But that’s not all. The improvements also concern the facing AI e l’imaging. As for the former, we have the new one APU 690which promises 35% higher performance (ETHZ5.0 benchmark), an updated Deep Learning Accelerator (DLA), and increased shared memory efficiency.

Front imaging, the new Imagiq 890 works together with the APU to enable AI video enhancements via the Video Stream Engine, as well as an increase in speed in the acquisition of photo ID-NO (for noise reduction in low light conditions), and at a lower power consumption of energy.

As for other features, the new SoC di MediaTek is the first chip ready for Wi-Fi 7as well as offering support for UFS 4.0 and RGBW sensors natively, and being equipped with exceptionally low latency (less than 53ms) BT audio output, as well as support for ultra-high fidelity 24-bit sound at 192 kHz.

Finally Dimensity 9200 comes with a new thermal control system and, as anticipated at the beginning, it is built on the second generation process a 4 nm di TSMC.

From the point of view of performancethis configuration promises performance in single-core 12% better in Geekbench 5.0 than Dimensity 9000, an improvement that boils down to 10% in multi-core. But the key to understanding is the graphics performance and the energy savingwith an improvement of up to 32% in Manhattan 3.0 over the Dimensity 9000, while still using 41% less power to boot, and the 25% less energy consumption under load, a fact that, added to the numbers of AnTuTu v9 (1,260,000 points), really make your mouth water.

But will we get to see this SoC or it will be relegated to one handful of smartphones like the Dimensity 9000 that only came with Asus ROG 6D Ultimate? Difficult to say, but it is more no than yes. MediaTek claimed that the new Dimensity 9200 will be available in the markets by the end of 2022, but without specifying on which devices, which does not bode well.

The Latest

To Top